Semiconductor arrangement and method of making

ABSTRACT

A semiconductor arrangement is provided. The semiconductor arrangement includes a first portion and a vertically conductive structure. The first portion includes a first dielectric layer and a first guard ring in the first dielectric layer. The first guard ring includes, in the first dielectric layer, a first metal layer coupled to a first via. The first portion includes a vertical conductive structure passing through the first dielectric layer and proximate by the first guard ring.

RELATED APPLICATION

This application is a continuation of and claims priority to U.S.application Ser. No. 16/787,079, titled “SEMICONDUCTOR ARRANGEMENT ANDMETHOD OF MAKING” and filed on Feb. 11, 2020, which is incorporatedherein by reference.

BACKGROUND

Semiconductor arrangements are used in a multitude of electronicdevices, such as mobile phones, laptops, desktops, tablets, watches,gaming systems, and various other industrial, commercial, and consumerelectronics. Semiconductor arrangements generally comprise semiconductorportions and wiring portions formed inside the semiconductor portions.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1-5 illustrate cross sectional views of a semiconductorarrangement at various stages of fabrication, in accordance with someembodiments.

FIG. 6 illustrates a top-down view of a semiconductor arrangement duringfabrication, in accordance with some embodiments.

FIGS. 7-9 illustrate cross sectional views of a semiconductorarrangement at various stages of fabrication, in accordance with someembodiments.

FIG. 10 illustrates a top-down view of a semiconductor arrangementduring fabrication, in accordance with some embodiments.

FIG. 11 illustrates a cross sectional view of a semiconductorarrangement during fabrication, in accordance with some embodiments.

FIG. 12 illustrates a top-down view of a semiconductor arrangementduring fabrication, in accordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides several different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation illustrated inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Some embodiments relate to a semiconductor arrangement. In accordancewith some embodiments, the semiconductor arrangement includes a firstportion including a first passivation layer, a first dielectric layerover the first passivation layer, a first substrate over the firstdielectric layer, a first conductive layer over the first substrate, anda first guard ring in the first dielectric layer. The semiconductorarrangement includes a second portion under the first portion. Thesecond portion includes a second passivation layer and a secondconductive layer in the second passivation layer. The semiconductorarrangement includes a vertical conductive structure passing through thefirst substrate, the first dielectric layer, and the first passivationlayer. In some embodiments, the vertical conductive structure contactsthe first conductive layer and the second conductive layer and issurrounded by the guard ring.

According to some embodiments, the first dielectric layer is an extralow-k (ELK) dielectric having a dielectric constant of about 2.6 orless. According to some embodiments, the guard ring protects, shields,electrically isolates, etc. at least one of the vertical conductivestructure or the first dielectric layer. In some embodiments, the guardring provides support, reinforcement, structural integrity, etc. for atleast one of the vertical conductive structure or the first dielectriclayer.

FIGS. 1-12 illustrate a semiconductor arrangement 100 at various stagesof fabrication, in accordance with some embodiments.

Referring to FIG. 1, a semiconductor arrangement 100 includes a firstportion 110 and a second portion 140, according to some embodiments. Insome embodiments, the first portion 110 and the second portion 140 arefabricated separately and then placed together. In some embodiments, thefirst portion 110 is fabricated, inverted to the orientation illustratedin FIG. 1, and then placed on top of the second portion 140.

In some embodiments, the first portion 110 includes a first passivationlayer 112, a first dielectric layer 114 over the first passivation layer112, a second dielectric layer 120 over the first dielectric layer 114,a third dielectric layer 122 over the second dielectric layer 120, afourth dielectric layer 124 over the third dielectric layer 122, a firstinterlayer dielectric (ILD) layer 126 over the fourth dielectric layer124, and a first substrate 116 over the first ILD layer 126. A firstguard ring 118 is in the first dielectric layer 114, the seconddielectric layer 120, the third dielectric layer 122, and the fourthdielectric layer 124, according to some embodiments. In someembodiments, the first portion 110 includes more than four dielectriclayers. In some embodiments, the first portion 110 includes fewer thanfour dielectric layers. In some embodiments, the first guard ring 118 isin all of the dielectric layers. In some embodiments, the first guardring 118 is in fewer than all of the dielectric layers.

In some embodiments, the first passivation layer 112 includes at leastone of AlN, Al₂O₃, SiO₂, or Si₃N₄, or other suitable materials. In someembodiments, the first passivation layer 112 includes a chemicallyinert, corrosion-resistant dielectric material. In some embodiments, thefirst passivation layer 112 includes an organic compound having at leastone of an N-, P- or S-group molecular structure. In some embodiments,the first passivation layer 112 has a dielectric constant of about 4.2.

In some embodiments, the first passivation layer 112 is formed by atleast one of physical vapor deposition (PVD), sputtering, chemical vapordeposition (CVD), low pressure CVD (LPCVD), atomic layer chemical vapordeposition (ALCVD), ultrahigh vacuum CVD (UHVCVD), reduced pressure CVD(RPCVD), molecular beam epitaxy (MBE), liquid phase epitaxy (LPE), spincoating, oxidation, a passivation process, or other suitable techniques.In some embodiments, a chemically-stable material is used to produce thefirst passivation layer 112. In some embodiments, the passivationprocess is a process in which a film covers an underlying material, suchas the first dielectric layer 114 prior to the first portion 110 beinginverted to the orientation illustrated in FIG. 1. In some embodiments,the film inhibits dissolution of the underlying material. In someembodiments, the film reduces chemical reactivity with regard to theunderlying material. In some embodiments, the film reduces electricalreactivity with regard to the underlying material. In some embodiments,the passivation process includes at least one of oxidation of a surfaceof the underlying material or complexing of the surface with an organiccompound. In some embodiments, the first passivation layer 112 inhibitsdiffusion of at least one of charges, atoms, or ions into the underlyingmaterial. In some embodiments, the first passivation layer 112 mitigatesoxidation of the underlying material. In some embodiments, the firstpassivation layer 112 protects the underlying material fromenvironmental conditions. In some embodiments, the first passivationlayer 112 acts as a diffusion barrier with regard to the underlyingmaterial.

In some embodiments, at least one of the dielectric layers 114, 120,122, or 124 includes at least one of a polymer, an oxide,polybenzobisoxazole (PBO), a polyimide (PI), a metal nitride, silicon,germanium, carbide, gallium, arsenide, germanium, arsenic, indium,silicon oxide, sapphire, or other suitable materials. In someembodiments, at least one of the dielectric layers 114, 120, 122, or 124electrically insulates inter connect lines in the first portion 110. Insome embodiments, at least one of the dielectric layers 114, 120, 122,or 124 is formed by at least one of physical vapor deposition (PVD),sputtering, chemical vapor deposition (CVD), low pressure CVD (LPCVD),atomic layer chemical vapor deposition (ALCVD), ultrahigh vacuum CVD(UHVCVD), reduced pressure CVD (RPCVD), molecular beam epitaxy (MBE),liquid phase epitaxy (LPE), spin coating, oxidation, or other suitabletechniques. In some embodiments, at least some of the dielectric layersare formed in a same manner. In some embodiments, at least some of thedielectric layers are formed in different manners.

According to some embodiments, at least one of the dielectric layers114, 120, 122, or 124 is an ELK dielectric having a dielectric constantof about 2.6 or less. In some embodiments, at least one of thedielectric layers 114, 120, 122, or 124 has a dielectric constant lessthan a dielectric constant of the first passivation layer 112.

In some embodiments, the first ILD layer 126 includes at least one oftetraethylorthosilicate (TEOS), borophosphosilicate glass (BPSG), fusedsilica glass (FSG), phosphosilicate glass (PSG), boron doped siliconglass (BSG), polymeric thermoset material, or other suitable materials.In some embodiments, the first ILD layer 126 reduces capacitive couplingbetween adjacent conductive lines. In some embodiments, the first ILDlayer 126 has a dielectric constant of about 4.2. In some embodiments,the first ILD layer 126 is formed by at least one of physical vapordeposition (PVD), sputtering, chemical vapor deposition (CVD), lowpressure CVD (LPCVD), atomic layer chemical vapor deposition (ALCVD),ultrahigh vacuum CVD (UHVCVD), reduced pressure CVD (RPCVD), molecularbeam epitaxy (MBE), liquid phase epitaxy (LPE), or other suitabletechniques.

In some embodiments, the first substrate 116 includes at least one of anepitaxial layer, a silicon-on-insulator (SOI) structure, a wafer, or adie formed from a wafer. In some embodiments, the first substrate 116includes silicon or other suitable materials.

According to some embodiments, the first guard ring 118 includes atleast one of a metal layer 128 or a vertical interconnect access (VIA)130. According to some embodiments, at least one of the metal layer 128or the VIA 130 includes at least one of Al, Cu, Sn, Ni, Au, Ag, W, orother suitable material. In some embodiments, at least one of the metallayer 128 or the VIA 130 does not include metal. In some embodiments, atleast one of the metal layer 128 or the VIA 130 is in at least one ofthe dielectric layers 114, 120, 122, or 124. According to someembodiments, the first guard ring 118 includes alternating layers of themetal layer 128 and the VIA 130. According to some embodiments, at leastsome of the metal layers 128 have a same width. In some embodiments, atleast some of the metal layers 128 have different widths. In someembodiments, at least some of the metal layers 128 have a same height.In some embodiments, at least some of the metal layers 128 havedifferent heights. In some embodiments, at least some of the metallayers 128 have different compositions as compared to other metal layers128. In some embodiments, at least some of the VIAs 130 have a samewidth. In some embodiments, at least some of the VIAs 130 have differentwidths. In some embodiments, at least some of the VIAs 130 have a sameheight. In some embodiments, at least some of the VIAs 130 havedifferent heights. In some embodiments, at least some of the VIAs 130have different compositions as compared to other VIAs 130.

According to some embodiments, a width of at least some metal layers 128is different than a width of at least some VIAs 130. In someembodiments, a width of at least some metal layers 128 is the same as awidth of at least some VIAs 130. In some embodiments, a height of atleast some metal layers 128 is different than a height of at least someVIAs 130. In some embodiments, a height of at least some metal layers128 is the same as a height of at least some VIAs 130. In someembodiments, the first guard ring 118 has a width 132 of about 3micrometers to about 6 micrometers. In some embodiments, the first guardring 118 has a height 134 of about 0.5 micrometer to about 4micrometers.

In some embodiments, at least one of the metal layer 128 or the VIA 130is formed by at least one of lithography, etching, physical vapordeposition (PVD), sputtering, chemical vapor deposition (CVD), lowpressure CVD (LPCVD), atomic layer chemical vapor deposition (ALCVD),ultrahigh vacuum CVD (UHVCVD), reduced pressure CVD (RPCVD), molecularbeam epitaxy (MBE), liquid phase epitaxy (LPE), or other suitabletechniques. In the lithography, a light sensitive material, such as aphotoresist is formed over a layer to be patterned. Properties, such assolubility, of the photoresist are affected by the light. Thephotoresist is either a negative photoresist or a positive photoresist.With respect to the negative photoresist, regions of the negativephotoresist become insoluble when illuminated by a light source, suchthat application of a solvent to the negative photoresist during asubsequent development stage removes non-illuminated regions of thenegative photoresist. A pattern formed in the negative photoresist isthus a negative of a pattern defined by opaque regions of a templatebetween the light source and the negative photoresist. In the positivephotoresist, illuminated regions of the positive photoresist becomesoluble and are removed via application of the solvent duringdevelopment. Thus, a pattern formed in the positive photoresist is apositive image of opaque regions of the template between the lightsource and the positive photoresist. According to some embodiments, anetchant has a selectivity such that the etchant removes or etches awaythe layer under the photoresist at a greater rate than the etchantremoves or etches away the photoresist. Accordingly, an opening in thephotoresist allows the etchant to form a corresponding opening in thelayer under the photoresist, and thereby transfer a pattern in thephotoresist to the layer under the photoresist. The pattern in the layerunder the photoresist is filled with one or more materials to form oneor more elements, features, etc. and the patterned photoresist isstripped or washed away at least one of before or after the pattern inthe layer under the photoresist is filled with the one or morematerials. In some embodiments, a dual damascene process is used to format least one of a metal layer 128 or a VIA 130.

In some embodiments, a metal layer 128 and a VIA 130 are formed in thefirst dielectric layer 114, then the second dielectric layer 120 isformed and a metal layer 128 and a VIA 130 are formed in the seconddielectric layer 120, then the third dielectric layer 122 is formed anda metal layer 128 and a VIA 130 are formed in the third dielectric layer122, then the fourth dielectric layer 124 is formed and a metal layer128 and a VIA 130 are formed in the fourth dielectric layer 124. In someembodiments, such a process is repeated any number of times to form thefirst guard ring 118. In some embodiments, the one or more dielectriclayers do not include at least one of a metal layer 128 or a VIA 130. Insome embodiments, the first guard ring 118 is discontinuous in that oneor more intervening dielectric layers do not include at least one of ametal layer 128 or a VIA 130. In some embodiments, at least one of oneor more of the metal layers 128 or one or more of the VIAs 130 areformed prior to at least some of a surrounding dielectric layer, such asat least one of at least some of the first dielectric layer 114, atleast some of the second dielectric layer 120, at least some of thethird dielectric layer 122, or at least some of the fourth dielectriclayer 124. In some embodiments, at least some of a layer is formed andpatterned to form at least one metal layer 128 and then at least some ofthe first dielectric layer 114 is formed around the at least one metallayer 128 such that the at least one metal layer 128 is in the firstdielectric layer 114. In some embodiments, at least some of a layer isformed and patterned to form at least one VIA 130 and then at least someof the first dielectric layer 114 is formed around the at least one VIA130 such that the at least one VIA 130 is in the first dielectric layer114. In some embodiments, at least some of a layer is formed andpatterned to form at least one metal layer 128 and then at least some ofthe second dielectric layer 120 is formed around the at least one metallayer 128 such that the at least one metal layer 128 is in the seconddielectric layer 120. In some embodiments, at least some of a layer isformed and patterned to form at least one VIA 130 and then at least someof the second dielectric layer 120 is formed around the at least one VIA130 such that the at least one VIA 130 is in the second dielectric layer120. In some embodiments, at least some of a layer is formed andpatterned to form at least one metal layer 128 and then at least some ofthe third dielectric layer 122 is formed around the at least one metallayer 128 such that the at least one metal layer 128 is in the thirddielectric layer 122. In some embodiments, at least some of a layer isformed and patterned to form at least one VIA 130 and then at least someof the third dielectric layer 122 is formed around the at least one VIA130 such that the at least one VIA 130 is in the third dielectric layer122. In some embodiments, at least some of a layer is formed andpatterned to form at least one metal layer 128 and then at least some ofthe fourth dielectric layer 124 is formed around the at least one metallayer 128 such that the at least one metal layer 128 is in the fourthdielectric layer 124.

In some embodiments, the first portion 110 includes at least one of oneor more conductive elements 200 or one or more contacts 121. In someembodiments, at least some of the conductive elements 200 include atleast one of Al, Cu, Sn, Ni, Au, Ag, W, or other suitable materials. Insome embodiments, at least some of the conductive elements 200 have asame composition as at least one of at least some of the metal layers128 or at least some of the VIAs 130. In some embodiments, at least someof the conductive elements 200 have a different composition than atleast one of at least some of the metal layers 128 or at least some ofthe VIAs 130. In some embodiments, at least some of the conductiveelements 200 have different compositions as compared to other conductiveelements 200. In some embodiments, at least some of the contacts 121include at least one of Al, Cu, Sn, Ni, Au, Ag, W, or other suitablematerials. In some embodiments, at least some of the contacts 121 have asame composition as at least one of at least some of the metal layers128, at least some of the VIAs 130, or at least some of the conductiveelements 200. In some embodiments, at least some of the contacts 121have a different composition than at least one of at least some of themetal layers 128, at least some of the VIAs 130, or at least some of theconductive elements 200. In some embodiments, at least some of thecontacts 121 have different compositions as compared to other contacts121. In some embodiments, at least one of the conductive element 200 orthe contact 121 does not include metal. In some embodiments, at leastsome contacts 201 are in contact with at least some conductive elements200. In some embodiments, a conductive element 200 serves as a routingline in the semiconductor arrangement 100 and a contact 201 that is intouch with the conductive element provides an electrically conductivepathway to the routing line.

According to some embodiments, any of the conductive elements 200 haveany desired shape or size. According to some embodiments, any of thecontacts 201 have any desired shape or size. In some embodiments, atleast one of the conductive element 200 or the contact 201 is formed byat least one of lithography, etching, physical vapor deposition (PVD),sputtering, chemical vapor deposition (CVD), low pressure CVD (LPCVD),atomic layer chemical vapor deposition (ALCVD), ultrahigh vacuum CVD(UHVCVD), reduced pressure CVD (RPCVD), molecular beam epitaxy (MBE),liquid phase epitaxy (LPE), or other suitable techniques. In someembodiments, a conductive element 200 is formed in the first dielectriclayer 114, then the second dielectric layer 120 is formed and aconductive element 200 is formed in the second dielectric layer 120,then the third dielectric layer 122 is formed and a conductive element200 is formed in the third dielectric layer 122, then the fourthdielectric layer 124 is formed and a conductive element 200 is formed inthe fourth dielectric layer 124. In some embodiments, such a process isrepeated any number of times. In some embodiments, at least one of thedielectric layers do not include a conductive element 200. In someembodiments, the first ILD layer 126 is formed and a contact 201 isformed, such as by etching and deposition, in the first ILD layer 126.In some embodiments, at least one of one or more of the conductiveelements 200 or one or more of the contacts 201 are formed prior to atleast some of a surrounding layer, such as at least one of at least someof the first dielectric layer 114, at least some of the seconddielectric layer 120, at least some of the third dielectric layer 122,at least some of the fourth dielectric layer 124, or at least some ofthe first ILD layer 126. In some embodiments, at least some of a layeris formed and patterned to form at least one conductive element 200 andthen at least some of the first dielectric layer 114 is formed aroundthe at least one conductive element 200 such that the at least oneconductive element 200 is in the first dielectric layer 114. In someembodiments, at least some of a layer is formed and patterned to form atleast one conductive element 200 and then at least some of the seconddielectric layer 120 is formed around the at least one conductiveelement 200 such that the at least one conductive element 200 is in thesecond dielectric layer 120. In some embodiments, at least some of alayer is formed and patterned to form at least one conductive element200 and then at least some of the third dielectric layer 122 is formedaround the at least one conductive element 200 such that the at leastone conductive element 200 is in the third dielectric layer 122. In someembodiments, at least some of a layer is formed and patterned to form atleast one conductive element 200 and then at least some of the fourthdielectric layer 124 is formed around the at least one conductiveelement 200 such that the at least one conductive element 200 is in thefourth dielectric layer 124. In some embodiments, at least some of alayer is formed and patterned to form at least one contact 201 and thenat least some of the first ILD layer 126 is formed around the at leastone contact 201 such that the at least one contact 201 is in the firstILD layer 126.

In some embodiments, the first portion 110 includes one or more etchstop layers 136, such as between adjacent dielectric layers. In someembodiments, an etch stop layer has a different etch selectivelyrelative to an overlying or adjacent layer such that when an etchantetches through the overlying layer the etching process slows or stopsupon the etchant encountering the underlying etch stop layer. Accordingto some embodiments, an etch stop layer comprises silicon, carbon, orother suitable materials. In some embodiments, at least some differentetch stop layers have different compositions, such as due to the use ofdifferent etchants to etch different materials. In some embodiments, theetch stop layer 136 between the first ILD layer 126 and the fourthdielectric layer 124 has a different composition than at least one otheretch stop layer 136, such as due to a different etchant used to etch thefirst ILD layer 126 as compared an etchant used to etch at least one ofthe fourth dielectric layer 124, the third dielectric layer 122, thesecond dielectric layer 120, or the first dielectric layer 114.

In some embodiments, the second portion 140 includes a secondpassivation layer 142, a conductive layer 144 in the second passivationlayer 142, a transition metal dielectric (TMD) layer 146 under thesecond passivation layer 142, a first inter-metal dielectric (IMD) layer152 under the TMD layer 146, a second IMD layer 154 under the first IMDlayer 152, a third IMD layer 156 under the second IMD layer 154, afourth IMD layer 158 under the third IMD layer 156, a second ILD layer160 under the fourth IMD layer 158, and a second substrate 162 under thesecond ILD layer 160. In some embodiments, the second portion 140includes more than four IMD layers. In some embodiments, the secondportion 140 includes fewer than four IMD layers.

In some embodiments, the second passivation layer 142 includes at leastone of AlN, Al₂O₃, SiO₂, or Si₃N₄, or other suitable materials. In someembodiments, the second passivation layer 142 includes a chemicallyinert, corrosion-resistant dielectric material. In some embodiments, thesecond passivation layer 142 includes an organic compound having atleast one of an N-, P- or S-group molecular structure. In someembodiments, the second passivation layer 142 includes heteroatoms. Insome embodiments, the second passivation layer 142 has a dielectricconstant of about 4.2. In some embodiments, the second passivation layer142 has a same composition as the first passivation layer 112. In someembodiments, the second passivation layer 142 has a differentcomposition than the first passivation layer 112. In some embodiments,the second passivation layer 142 is formed by at least one of apassivation process, physical vapor deposition (PVD), sputtering,chemical vapor deposition (CVD), low pressure CVD (LPCVD), atomic layerchemical vapor deposition (ALCVD), ultrahigh vacuum CVD (UHVCVD),reduced pressure CVD (RPCVD), molecular beam epitaxy (MBE), liquid phaseepitaxy (LPE), spin coating, oxidation, or other suitable techniques. Insome embodiments, the second passivation layer 142 is formed in a samemanner as the first passivation layer 112. In some embodiments, thesecond passivation layer 142 is formed in a different manner than thefirst passivation layer 112.

In some embodiments, the conductive layer 144 includes at least one ofAl, Cu, Sn, Ni, Au, Ag, W, or other suitable materials. In someembodiments, the conductive layer 144 includes a binary alloy ofaluminum and copper. In some embodiments, the conductive layer 144 isembedded in the second passivation layer 142 so as to be covered on allsides by the second passivation layer 142. In some embodiments, theconductive layer 144 is formed by at least one of lithography, etching,physical vapor deposition (PVD), sputtering, chemical vapor deposition(CVD), low pressure CVD (LPCVD), atomic layer chemical vapor deposition(ALCVD), ultrahigh vacuum CVD (UHVCVD), reduced pressure CVD (RPCVD),molecular beam epitaxy (MBE), liquid phase epitaxy (LPE), or othersuitable techniques.

In some embodiments, the TMD layer 146 includes at least one of Al, Cu,Sn, Ni, Au, Ag, W, or other suitable materials. In some embodiments, theTMD layer 146 includes an atomically thin layer of a transition metaland a chalcogen. In some embodiments, the transition metal includes atleast one of Mo, W, or other suitable materials. In some embodiments,the chalcogen includes at least one of S, Si, Te, or other suitablematerials. According to some embodiments, atoms of the transition metalare sandwiched between two layers of chalcogen atoms. In someembodiments, the TMD layer 146 is formed by at least one of physicalvapor deposition (PVD), sputtering, chemical vapor deposition (CVD), lowpressure CVD (LPCVD), atomic layer chemical vapor deposition (ALCVD),ultrahigh vacuum CVD (UHVCVD), reduced pressure CVD (RPCVD), molecularbeam epitaxy (MBE), liquid phase epitaxy (LPE), or other suitabletechniques.

According to some embodiments, at least one of the IMD layers 152, 154,156, or 158 includes at least one of a polymer, an oxide,polybenzobisoxazole (PBO), a polyimide (PI), a metal nitride, silicon,germanium, carbide, gallium, arsenide, germanium, arsenic, indium,silicon oxide, sapphire, or other suitable materials. In someembodiments, at least one of the IMD layers 152, 154, 156, or 158electrically insulate inter connect lines in the second portion 140. Insome embodiments, at least one of the IMD layers 152, 154, 156, or 158is formed by at least one of physical vapor deposition (PVD),sputtering, chemical vapor deposition (CVD), low pressure CVD (LPCVD),atomic layer chemical vapor deposition (ALCVD), ultrahigh vacuum CVD(UHVCVD), reduced pressure CVD (RPCVD), molecular beam epitaxy (MBE),liquid phase epitaxy (LPE), spin coating, oxidation, or other suitabletechniques. In some embodiments, at least some of the IMD layers areformed in a same manner. In some embodiments, at least some of the IMDlayers are formed in different manners.

According to some embodiments, at least one of the IMD layers 152, 154,156, or 158 has a dielectric constant of about 3 or less. In someembodiments, at least one of the IMD layers 152, 154, 156, or 158 has adielectric constant less than a dielectric constant of the secondpassivation layer 142.

In some embodiments, the second ILD layer 160 includes at least one oftetraethylorthosilicate (TEOS), borophosphosilicate glass (BPSG), fusedsilica glass (FSG), phosphosilicate glass (PSG), boron doped siliconglass (BSG), polymeric thermoset material, or other suitable materials.In some embodiments, the second ILD layer 160 reduces capacitivecoupling between adjacent conductive lines. In some embodiments, thesecond ILD layer 160 has a dielectric constant of about 4.2. In someembodiments, the second ILD layer 160 is formed by at least one ofphysical vapor deposition (PVD), sputtering, chemical vapor deposition(CVD), low pressure CVD (LPCVD), atomic layer chemical vapor deposition(ALCVD), ultrahigh vacuum CVD (UHVCVD), reduced pressure CVD (RPCVD),molecular beam epitaxy (MBE), liquid phase epitaxy (LPE), or othersuitable techniques. In some embodiments, the second ILD layer 160 isformed in a same manner as the first ILD layer 126. In some embodiments,the second ILD layer 160 is formed in a different manner than the firstILD layer 126.

In some embodiments, the second substrate 162 includes at least one ofan epitaxial layer, a silicon-on-insulator (SOI) structure, a wafer, ora die formed from a wafer. In some embodiments, the second substrate 162includes silicon or other suitable materials. In some embodiments, thesecond substrate 162 has a same composition as the first substrate 116.In some embodiments, the second substrate 162 has a differentcomposition than the first substrate 116. In some embodiments, thesecond portion 140 includes at least one of one or more conductiveelements 200, one or more contacts 201, or one or more etch stop layers136. In some embodiments, at least some of the conductive elements 200in the second portion 140 at least one of have a same composition, areformed in a same manner, perform a same function, etc. as at least someof the conductive elements 200 in the first portion 110. In someembodiments, at least some of the contacts 201 in the second portion 140at least one of have a same composition, are formed in a same manner,perform a same function, etc. as at least some of the contacts 201 inthe first portion 110. In some embodiments, at least some of the etchstop layers 136 in the second portion 140 at least one of have a samecomposition, are formed in a same manner, perform a same function, etc.as at least some of the etch stop layers 136 in the first portion 110.

FIG. 2 illustrates the first portion 110 on the second portion 140,according to some embodiments. According to some embodiments, the firstpassivation layer 112 contacts the second passivation layer 142.According to some embodiments, the first passivation layer 112 isadhered to the second passivation layer 142. According to someembodiments, a delineation persists between the first passivation layer112 and the second passivation layer 142 despite the first passivationlayer 112 being at least one of in contact with or adhered to the secondpassivation layer 142.

Referring to FIG. 3, an opening 180 is formed in the first portion 110and the second portion 140. In some embodiments, the opening 180 isformed so that the opening 180 is surrounded by the first guard ring118. In some embodiments, the opening 180 is formed from a top surfaceof the first substrate 116 and extends through the first substrate 116,the first ILD layer 126, the fourth dielectric layer 124, the thirddielectric layer 122, the second dielectric layer 120, the firstdielectric layer 114, the first passivation layer 112, and the secondpassivation layer 142. In some embodiments, the opening 180 exposes theconductive layer 144.

In some embodiments, the opening 180 is formed by at least one oflithography, etching, or other suitable techniques. According to someembodiments, an etchant has a selectivity such that the etchant removesor etches away the first substrate 116, the first ILD layer 126, thefourth dielectric layer 124, the third dielectric layer 122, the seconddielectric layer 120, the first dielectric layer 114, the firstpassivation layer 112, and the second passivation layer 142 at a greaterrate than the etchant removes or etches away an overlying patternedphotoresist. According to some embodiments, the opening 180 is definedby sidewalls of the first substrate 116, the first ILD layer 126, thefourth dielectric layer 124, the third dielectric layer 122, the seconddielectric layer 120, the first dielectric layer 114, the firstpassivation layer 112, and the second passivation layer 142. In someembodiments, the etchant removes or etches away an amount of at leastone of the first substrate 116, the first ILD layer 126, the fourthdielectric layer 124, the third dielectric layer 122, the seconddielectric layer 120, the first dielectric layer 114, the firstpassivation layer 112, or the second passivation layer 142 so as toexpose at least some of at least one of a metal layer 128 or a VIA 130and thus at least some of the opening 180 is defined by at least some ofat least one of a metal layer 128 or a VIA 130.

In some embodiments, the opening 180 has a width 182 and a height 184.In some embodiments, the width 182 is about 0.5 micrometers to about 4micrometers. In some embodiments, the height 184 is about 3 micrometersto about 8 micrometers. According to some embodiments, the opening 180is defined by tapered sidewalls such that the width 182 varies along theheight 184 of the opening 180. In some embodiments, the width 182decreases moving in a direction from the first substrate 116 to theconductive layer 144. According to some embodiments, the opening has anycross sectional profile, such as stair stepped, hourglass, non-tapered,etc., such as from at least one of using one or more etchants or usingone or more etching processes, such as directional etching, isotropicetching, anisotropic etching, etc.

Referring to FIG. 4, a conductive material 150 is formed over the firstsubstrate 116 and in the opening 180. In some embodiments, theconductive material 150 includes at least one of includes Al, Cu, Sn,Ni, Au, Ag, W, or other suitable materials. In some embodiments, theconductive material is formed by at least one of focused-ion beam (FIB),physical vapor deposition (PVD), sputtering, chemical vapor deposition(CVD), low pressure CVD (LPCVD), atomic layer chemical vapor deposition(ALCVD), ultrahigh vacuum CVD (UHVCVD), reduced pressure CVD (RPCVD),molecular beam epitaxy (MBE), liquid phase epitaxy (LPE), or othersuitable techniques.

Referring to FIG. 5, excess conductive material is removed to establisha vertical conductive structure 186 in the opening 180. In someembodiments, removal of the excess material conductive exposes the topsurface of the first substrate 116. In some embodiments, the verticalconductive structure 186 has a width 188 and a height 190. According tosome embodiments, the width 188 of the vertical conductive structure 186corresponds to the width 182 of the opening 180. According to someembodiments, the height 190 of the vertical conductive structure 186corresponds to the height 184 of the opening 180. According to someembodiments, the vertical conductive structure 186 has any crosssectional profile. According to some embodiments, the verticalconductive structure 186 has a cross sectional profile that correspondsto the cross sectional profile of the opening. According to someembodiments, the width 188 varies along the height 190 of the verticalconductive structure 186. In some embodiments, the width 188 decreasesmoving in a direction from the first substrate 116 to the conductivelayer 144. According to some embodiments, one or more sidewalls of thevertical conductive structure 186 are at least one of tapered, stairstepped, non-linear, non-tapered, etc. In some embodiments, the excessconductive material is removed by at least one of chemical mechanicalpolishing (CMP) or other suitable techniques. In some embodiments, anabrasive slurry is used in the removal of the excess material. In someembodiments, the vertical conductive structure 186 comprises athrough-silicon VIA (TSV). In some embodiments, a TSV is ahigh-performance interconnect used as an alternative to wire-bond andflip chips. In some embodiments, the TSV is used in creating 3Dpackages. In some embodiments, the TSV is used to create 3D integratedcircuits (ICs). In some embodiments, the TSV is used to shorten lengthsof connections. In some embodiments, the vertical conductive structure186 comprises a through-organic VIA (TOV).

According to some embodiments, a barrier layer (not shown) is formedover sidewalls, surfaces, etc. defining the opening 180 prior to theconductive material 150. According to some embodiments, the barrierlayer is relatively thin and does not fill the opening 180, such thatthe conductive material 150 is formed over the barrier layer. Accordingto some embodiments, the barrier layer includes at least one of titaniumnitride, titanium oxynitride, tantalum nitride, tantalum oxynitride,tungsten nitride, or other suitable materials. In some embodiments, thebarrier layer is formed by at least one of focused-ion beam (FIB),physical vapor deposition (PVD), sputtering, chemical vapor deposition(CVD), low pressure CVD (LPCVD), atomic layer chemical vapor deposition(ALCVD), ultrahigh vacuum CVD (UHVCVD), reduced pressure CVD (RPCVD),molecular beam epitaxy (MBE), liquid phase epitaxy (LPE), or othersuitable techniques.

FIG. 6 illustrates a top-down view of the semiconductor arrangement 100of FIG. 5 when the first substrate 116, the first ILD layer 126, and theetch stop layer 136 are removed, according to some embodiments.According to some embodiments, FIG. 5 corresponds to a cross sectionalview taken along line 5-5 in FIG. 6. In some embodiments, the pluralityof conductive elements 200 exist around the first guard ring 118. Insome embodiments, conductive elements 200 are used as wiring inside thesemiconductor arrangement 100. According to some embodiments, the firstguard ring 118 completely surrounds, encircles, etc. all sides orsidewalls of the vertical conductive structure 186. According to someembodiments, the first guard ring 118 is discontinuous or has a break soas to surround, encircle, etc. some but not all of the verticalconductive structure 186.

Although illustrated as generally quadrilateral, according to someembodiments a top profile of at least one of the vertical conductivestructure 186 or the first guard ring 118 is any desired shape otherthan quadrilateral, such as at least one of elliptical, polygonal, starshaped, etc.

Referring to FIG. 7, a conductive layer 192 is formed over the firstsubstrate 116 and the vertical conductive structure 186. In someembodiments, the conductive layer 192 includes at least one of Al, Cu,Sn, Ni, Au, Ag, W, or other suitable materials. In some embodiments, theconductive layer 192 has a same composition as at least one of theconductive layer 144 or the vertical conductive structure 186. In someembodiments, the conductive layer 192 has a different composition thanat least one of the conductive layer 144 or the vertical conductivestructure 186. In some embodiments, the conductive layer 144 is formedby at least one of physical vapor deposition (PVD), sputtering, chemicalvapor deposition (CVD), low pressure CVD (LPCVD), atomic layer chemicalvapor deposition (ALCVD), ultrahigh vacuum CVD (UHVCVD), reducedpressure CVD (RPCVD), molecular beam epitaxy (MBE), liquid phase epitaxy(LPE), or other suitable techniques.

Referring to FIG. 8, the conductive layer 192 is patterned so thatportions of the conductive layer 192 are removed from the top surface ofthe first substrate 116. In some embodiments, the portions of theconductive layer are removed such that the conductive layer 192 coversat least some of the vertical conductive structure 186. In someembodiments, the conductive layer 192 is patterned by at least one oflithography, etching, or other suitable techniques. According to someembodiments, the vertical conductive structure 186 connects theconductive layer 192 in or on the first portion 110 of the semiconductorarrangement 100 to the conductive layer 144 in the second portion 140 ofthe semiconductor arrangement 100 while being at least partiallysurrounded, encircled, etc. by the first guard ring 118.

FIG. 9, illustrates the semiconductor arrangement 100 according to someembodiments. In some embodiments a second guard ring 194 is formedadjacent to, around, concentric to, etc. the first guard ring 118. Insome embodiments, at least some of the second guard ring 194 is incontact with at least some of the first guard ring 118. In someembodiments, the second guard ring 194 is not in contact with the firstguard ring 118.

According to some embodiments, the second guard ring 194 includes atleast one of a metal layer 196 or a vertical interconnect access (VIA)198. According to some embodiments, at least one of the metal layer 196or the VIA 198 includes at least one of Al, Cu, Sn, Ni, Au, Ag, W, orother suitable materials. In some embodiments, at least one of the metallayer 196 or the VIA 198 does not include metal. In some embodiments,the second guard ring 194 has a same composition as the first guard ring118. In some embodiments, the second guard ring 194 has a differentcomposition than the first guard ring 118.

In some embodiments, at least one of the metal layer 196 or the VIA 198is in at least one of the dielectric layers 114, 120, 122, or 124.According to some embodiments, the second guard ring 194 includesalternating layers of the metal layer 196 and the VIA 198. According tosome embodiments, at least some of the metal layers 196 have a samewidth. In some embodiments, at least some of the metal layers 196 havedifferent widths. In some embodiments, at least some of the metal layers196 have a same height. In some embodiments, at least some of the metallayers 196 have different heights. In some embodiments, at least some ofthe VIAs 198 have a same width. In some embodiments, at least some ofthe VIAs 198 have different widths. In some embodiments, at least someof the VIAs 198 have a same height. In some embodiments, at least someof the VIAs 198 have different heights.

According to some embodiments, at least some of the metal layers 196have a same width as at least one of at least some of the metal layers128, at least some of the VIAs 130, or at least some of the VIAs 198. Insome embodiments, at least some of the metal layers 196 have a differentwidth than at least one of at least some of the metal layers 128, atleast some of the VIAs 130, or at least some of the VIAs 198. In someembodiments, at least some of the metal layers 196 have a same height asat least one of at least some of the metal layers 128, at least some ofthe VIAs 130, or at least some of the VIAs 198. In some embodiments, atleast some of the metal layers 196 have a different height than at leastone of at least some of the metal layers 128, at least some of the VIAs130, or at least some of the VIAs 198. In some embodiments, the secondguard ring 194 has a width 137 of about 3 micrometers to about 7micrometers. In some embodiments, the second guard ring 194 has a height138 of about 0.5 micrometer to about 4 micrometers. In some embodiments,the width 137 of second guard ring 194 is the same as the width 132 ofthe first guard ring 118. In some embodiments, the width 137 of secondguard ring 194 is different than the width 132 of the first guard ring118. In some embodiments, the height 138 of second guard ring 194 is thesame as the height 134 of the first guard ring 118. In some embodiments,the height 138 of second guard ring 194 is different than the height 134of the first guard ring 118.

In some embodiments, at least one of the metal layer 196 or the VIA 198is formed by at least one of lithography, etching, physical vapordeposition (PVD), sputtering, chemical vapor deposition (CVD), lowpressure CVD (LPCVD), atomic layer chemical vapor deposition (ALCVD),ultrahigh vacuum CVD (UHVCVD), reduced pressure CVD (RPCVD), molecularbeam epitaxy (MBE), liquid phase epitaxy (LPE), or other suitabletechniques. In some embodiments, at least some of the second guard ring194 is formed in a same manner as at least some of the first guard ring118. In some embodiments, at least some of the second guard ring 194 isformed in a different manner than at least some of the first guard ring118.

In some embodiments, a metal layer 196 and a VIA 198 are formed in thefirst dielectric layer 114, then the second dielectric layer 120 isformed and a metal layer 196 and a VIA 198 are formed in the seconddielectric layer 120, then the third dielectric layer 122 is formed anda metal layer 196 and a VIA 198 are formed in the third dielectric layer122, then the fourth dielectric layer 124 is formed and a metal layer196 and a VIA 198 are formed in the fourth dielectric layer 124. In someembodiments, such a process is repeated any number of times to form thesecond guard ring 194. In some embodiments, one or more dielectriclayers do not include at least one of a metal layer 196 or a VIA 198. Insome embodiments, the second guard ring 194 is discontinuous in that oneor more intervening dielectric layers do not include at least one of ametal layer 196 or a VIA 198. In some embodiments, a dielectric layerincludes some of the second guard ring 194 but none of the first guardring 118. In some embodiments, a dielectric layer includes none of thesecond guard ring 194 but some of the first guard ring 118.

FIG. 10 illustrates a top-down view of the semiconductor arrangement 100of FIG. 9 when the conductive layer 192, the first substrate 116, thefirst ILD layer 126, and the etch stop layer 136 are removed, accordingto some embodiments. According to some embodiments, FIG. 9 correspondsto a cross sectional view taken along line 9-9 in FIG. 10. In someembodiments, the plurality of conductive elements 200 exist around thefirst guard ring 118 and the second guard ring 194. In some embodiments,at least some of the plurality of conductive elements 200 have a samecomposition as at least one of at least some of the metal layers 196 orat least some of the VIAs 198. In some embodiments, at least some of theplurality of conductive elements 200 have a different composition thanat least one of at least some of the metal layers 196 or at least someof the VIAs 198.

In some embodiments, conductive elements 200 are used as wiring insidethe semiconductor arrangement 100. According to some embodiments, thefirst guard ring 118 completely surrounds, encircles, etc. all sides orsidewalls of the vertical conductive structure 186. According to someembodiments, the first guard ring 118 is discontinuous or has a break soas to surround, encircle, etc. some but not all of the verticalconductive structure 186. According to some embodiments, the secondguard ring 194 completely surrounds, encircles, etc. at least one of allsides or sidewalls of the vertical conductive structure 186 or all sidesor sidewalls of the first guard ring 118. According to some embodiments,the second guard ring 194 is discontinuous or has a break so as tosurround, encircle, etc. some but not all of at least one of thevertical conductive structure 186 or the first guard ring 118.

Although illustrated as generally quadrilateral, according to someembodiments a top profile of at least one of the vertical conductivestructure 186, the first guard ring 118, or the second guard ring 194 isany desired shape other than quadrilateral, such as at least one ofelliptical, polygonal, star shaped, etc.

FIG. 11 illustrates the semiconductor arrangement 100 where the metallayers 128, the VIAs 130, the metal layers 196, and the VIAs 198 havesubstantially uniform dimensions, such as widths and heights, accordingto some embodiments. In some embodiments, the first guard ring 118 isdiscontinuous in that one or more intervening dielectric layers do notinclude at least one of a metal layer 128 or a VIA 130. In someembodiments, the second guard ring 194 is discontinuous in that one ormore intervening dielectric layers do not include at least one of ametal layer 196 or a VIA 198.

FIG. 12 illustrates a top-down view of the semiconductor arrangement 100of FIG. 11 when the conductive layer 192, the first substrate 116, thefirst ILD layer 126, and the etch stop layer 136 are removed, accordingto some embodiments. According to some embodiments, FIG. 11 correspondsto a cross sectional view taken along line 11-11 in FIG. 12. FIG. 12mirrors FIG. 10 given that merely the uppermost metal layer 128 of thefirst guard ring 118 and the uppermost metal layer 196 of the secondguard ring 194 are visible in FIG. 10 and in FIG. 12. According to someembodiments, the first guard ring 118 completely surrounds, encircles,etc. all sides or sidewalls of the vertical conductive structure 186.According to some embodiments, the first guard ring 118 is discontinuousor has a break so as to surround, encircle, etc. some but not all of thevertical conductive structure 186. According to some embodiments, thesecond guard ring 194 completely surrounds, encircles, etc. at least oneof all sides or sidewalls of the vertical conductive structure 186 orall sides or sidewalls of the first guard ring 118. According to someembodiments, the second guard ring 194 is discontinuous or has a breakso as to surround, encircle, etc. some but not all of at least one ofthe vertical conductive structure 186 or the first guard ring 118.

Although illustrated as generally quadrilateral, according to someembodiments a top profile of at least one of the vertical conductivestructure 186, the first guard ring 118, or the second guard ring 194 isany desired shape other than quadrilateral, such as at least one ofelliptical, polygonal, star shaped, etc.

According to some embodiments, the first portion 110 of thesemiconductor arrangement 100 is associated with backside Illumination(BSI) contact image sensors (CIS). In some embodiments, image sensorsare turned upside down and color filters and micro-lenses are applied tobacksides of pixels for light collection. In some embodiments, sucharrangements of elements increase an amount of light captured andthereby improve performance in low-light situations. In someembodiments, the second portion 140 of the semiconductor arrangement 100is associated with an application specific integrated circuit (ASIC).

According to some embodiments, a semiconductor arrangement includes afirst portion and a second portion under the first portion. The firstportion includes a first passivation layer, a first dielectric layerover the first passivation layer, a first substrate over the firstdielectric layer, a first conductive layer over the first substrate, anda first guard ring in the first dielectric layer. The second portionincludes a second passivation layer, a second conductive layer in thesecond passivation layer, a second dielectric layer under the secondpassivation layer; and a second substrate under the second dielectriclayer. The semiconductor arrangement includes a vertical conductivestructure passing through the first substrate, the first dielectriclayer, and the first passivation layer, wherein the vertical conductivestructure contacts the first conductive layer and the second conductivelayer and is surrounded by the first guard ring.

In some embodiments, the first passivation layer is in contact with thesecond passivation layer.

In some embodiments, the vertical conductive structure has a taperedsidewall.

In some embodiments, the first dielectric layer is an extra low-kdielectric.

In some embodiments, the first conductive layer covers portions of thefirst substrate.

In some embodiments, the first portion includes a second dielectriclayer wherein the vertical conductive structure passes through thesecond dielectric layer and the first guard ring is in the seconddielectric layer.

In some embodiments, the first portion includes a second guard ring inthe first dielectric layer and surrounding the first guard ring.

In some embodiments, the first guard ring and the second guard ring arenot connected to each other.

According to some embodiments, a semiconductor arrangement includes afirst portion and a vertical conductive structure. The first portionincludes a first dielectric layer and a first guard ring in the firstdielectric layer, wherein the first guard ring comprises, in the firstdielectric layer, a first metal layer coupled to a first via. Thevertical conductive structure passes through the first dielectric layerand is proximate the first guard ring.

In some embodiments, the first portion includes a second dielectriclayer wherein the vertical conductive structure passes through thesecond dielectric layer and the first guard ring is in the seconddielectric layer.

In some embodiments, the first guard ring includes, in the seconddielectric layer, a second metal layer coupled to a second via.

In some embodiments, the first portion includes a third dielectric layerbetween the first dielectric layer and the second dielectric layer, thevertical conductive structure passes through the third dielectric layer,and the first guard ring is not in the third dielectric layer.

In some embodiments, the first metal layer has a first width and thefirst via has a second width less than the first width.

In some embodiments, the first portion includes a second guard ring inthe first dielectric layer and around the first guard ring.

In some embodiments, the first portion includes a second dielectriclayer and a third dielectric layer, the third dielectric layer isbetween the first dielectric layer and the second dielectric layer, thevertical conductive structure passes through the second dielectriclayer, the vertical conductive structure passes through the thirddielectric layer, the first guard ring is in the second dielectric layerbut not the third dielectric layer, and the second guard ring is in thethird dielectric layer but not the second dielectric layer.

In some embodiments, the first dielectric layer is an extra low-kdielectric.

According to some embodiments, a method for forming a semiconductorarrangement, includes forming a first guard ring in a first dielectriclayer and forming a vertical conductive structure having a taperedsidewall and that passes through the first dielectric layer and issurrounded by the first guard ring.

In some embodiments, the method includes forming a second guard ring inthe first dielectric layer, wherein the second guard ring surrounds thefirst guard ring.

In some embodiments, the method includes forming the first guard ring ina second dielectric layer, wherein forming the vertical conductivestructure includes forming the vertical conductive structure to passthrough the second dielectric layer.

In some embodiments, forming the first guard ring includes forming afirst metal layer in the first dielectric layer and forming a first viain the first dielectric layer and in contact with the first metal layer.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

Although the subject matter has been described in language specific tostructural features or methodological acts, it is to be understood thatthe subject matter of the appended claims is not necessarily limited tothe specific features or acts described above. Rather, the specificfeatures and acts described above are disclosed as example forms ofimplementing at least some of the claims.

Various operations of embodiments are provided herein. The order inwhich some or all of the operations are described should not beconstrued to imply that these operations are necessarily orderdependent. Alternative ordering will be appreciated having the benefitof this description. Further, it will be understood that not alloperations are necessarily present in each embodiment provided herein.Also, it will be understood that not all operations are necessary insome embodiments.

It will be appreciated that layers, features, elements, etc. depictedherein are illustrated with particular dimensions relative to oneanother, such as structural dimensions or orientations, for example, forpurposes of simplicity and ease of understanding and that actualdimensions of the same differ substantially from that illustratedherein, in some embodiments. Additionally, a variety of techniques existfor forming the layers, regions, features, elements, etc. mentionedherein, such as at least one of etching techniques, planarizationtechniques, implanting techniques, doping techniques, spin-ontechniques, sputtering techniques, growth techniques, or depositiontechniques such as chemical vapor deposition (CVD), for example.

Moreover, “exemplary” is used herein to mean serving as an example,instance, illustration, etc., and not necessarily as advantageous. Asused in this application, “or” is intended to mean an inclusive “or”rather than an exclusive “or”. In addition, “a” and “an” as used in thisapplication and the appended claims are generally be construed to mean“one or more” unless specified otherwise or clear from context to bedirected to a singular form. Also, at least one of A and B and/or thelike generally means A or B or both A and B. Furthermore, to the extentthat “includes”, “having”, “has”, “with”, or variants thereof are used,such terms are intended to be inclusive in a manner similar to the term“comprising”. Also, unless specified otherwise, “first,” “second,” orthe like are not intended to imply a temporal aspect, a spatial aspect,an ordering, etc. Rather, such terms are merely used as identifiers,names, etc. for features, elements, items, etc. For example, a firstelement and a second element generally correspond to element A andelement B or two different or two identical elements or the sameelement.

Also, although the disclosure has been shown and described with respectto one or more implementations, equivalent alterations and modificationswill occur to others of ordinary skill in the art based upon a readingand understanding of this specification and the annexed drawings. Thedisclosure comprises all such modifications and alterations and islimited only by the scope of the following claims. In particular regardto the various functions performed by the above described components(e.g., elements, resources, etc.), the terms used to describe suchcomponents are intended to correspond, unless otherwise indicated, toany component which performs the specified function of the describedcomponent (e.g., that is functionally equivalent), even though notstructurally equivalent to the disclosed structure. In addition, while aparticular feature of the disclosure may have been disclosed withrespect to only one of several implementations, such feature may becombined with one or more other features of the other implementations asmay be desired and advantageous for any given or particular application.

What is claimed is:
 1. A method for forming a semiconductor arrangement,comprising: forming a first guard ring in a first dielectric layer; andforming a vertical conductive structure having a tapered sidewall andthat passes through the first dielectric layer and is surrounded by thefirst guard ring such that a first surface of the first guard ring isspaced apart in a lateral direction from a second surface of the firstguard ring by the vertical conductive structure.
 2. The method of claim1, comprising: forming a second guard ring laterally surrounding thefirst guard ring.
 3. The method of claim 1, wherein: forming the firstguard ring comprises forming the first guard ring over a firstsubstrate, and the method comprises: forming a conductive layer over asecond substrate; inverting the first guard ring and first substratesuch that the first substrate is over the first guard ring; and fixingthe first guard ring and the first substrate to the conductive layersuch that the first guard ring is over the conductive layer.
 4. Themethod of claim 3, wherein fixing the first guard ring and the firstsubstrate to the conductive layer comprises fixing the first guard ringand the first substrate to the conductive layer such that the firstguard ring overlies the conductive layer.
 5. The method of claim 3,comprising: forming an opening in the first dielectric layer, wherein:the opening exposes the conductive layer, and forming the verticalconductive structure comprises forming the vertical conductive structurein the opening to contact the conductive layer.
 6. The method of claim1, comprising: forming the first guard ring in a second dielectriclayer, wherein forming the vertical conductive structure comprisesforming the vertical conductive structure to pass through the seconddielectric layer.
 7. The method of claim 1, wherein forming the firstguard ring comprises: forming a first metal layer in the firstdielectric layer; and forming a first via in the first dielectric layerand in contact with the first metal layer.
 8. A method for forming asemiconductor arrangement, comprising: forming a first guard ring in afirst dielectric layer; forming a second guard ring in the firstdielectric layer laterally surrounding the first guard ring; and forminga vertical conductive structure having a tapered sidewall and thatpasses through the first dielectric layer and is laterally surrounded bythe first guard ring.
 9. The method of claim 8, wherein: forming thefirst guard ring comprises forming the first guard ring over a firstsubstrate, and the method comprises: forming a conductive layer over asecond substrate; inverting the first guard ring and first substratesuch that the first substrate is over the first guard ring; and fixingthe first guard ring and the first substrate to the conductive layersuch that the first guard ring is over the conductive layer.
 10. Themethod of claim 9, wherein forming the vertical conductive structurecomprises forming the vertical conductive structure after fixing thefirst guard ring and the first substrate to the conductive layer. 11.The method of claim 9, wherein forming the vertical conductive structurecomprises forming the vertical conductive structure to contact theconductive layer.
 12. The method of claim 8, wherein forming thevertical conductive structure comprises: forming an opening in asubstrate overlying the first guard and in the first dielectric layer.13. The method of claim 12, wherein forming the vertical conductivestructure comprises: forming a conductive material in the opening andover the substrate.
 14. A semiconductor arrangement, comprising: a firstdielectric layer; and a first guard ring in the first dielectric layer;and a vertical conductive structure passing through the first dielectriclayer, wherein the vertical conductive structure is surrounded by thefirst guard ring on at least two sides.
 15. The semiconductorarrangement of claim 14, comprising: a conductive layer underlying thefirst guard ring, wherein the vertical conductive structure contacts theconductive layer.
 16. The semiconductor arrangement of claim 14,comprising: a second guard ring in the first dielectric layer, whereinthe vertical conductive structure is surrounded by the second guard ringon at least two sides.
 17. The semiconductor arrangement of claim 16,wherein the first guard ring and the second guard ring are not connectedto each other.
 18. The semiconductor arrangement of claim 14,comprising: a conductive layer underlying the first guard ring; and apassivation layer, wherein the first guard ring is separated from theconductive layer by the passivation layer.
 19. The semiconductorarrangement of claim 14, wherein the first guard ring is spaced apartfrom the vertical conductive structure by a portion of the firstdielectric layer.
 20. The semiconductor arrangement of claim 14,comprising: a second dielectric layer over the first dielectric layer,wherein the first guard ring is in the second dielectric layer.